Intel Creates World’s First End-to-End Silicon Photonics Connection with Integrated Lasers; Could Revolutionize Computer Design, Dramatically Increase Performance, Save Energy
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel Corporation today announced an important advance in the quest to use light beams to replace the use of electrons to carry data in and around computers. The company has developed a research prototype representing the world’s first silicon-based optical data connection with integrated lasers. The link can move data over longer distances and many times faster than today’s copper technology; up to 50 gigabits of data per second. This is the equivalent of an entire HD movie being transmitted each second.
Today computer components are connected to each other using copper
cables or traces on circuit boards. Due to the signal degradation that
comes with using metals such as copper to transmit data, these cables
have a limited maximum length. This limits the design of computers,
forcing processors, memory and other components to be placed just inches
from each other. Today’s research achievement is another step toward
replacing these connections with extremely thin and light optical fibers
that can transfer much more data over far longer distances, radically
changing the way computers of the future are designed and altering the
way the datacenter of tomorrow is architected.
Silicon photonics will have applications across the computing industry.
For example, at these data rates one could imagine a wall-sized 3D
display for home entertainment and videoconferencing with a resolution
so high that the actors or family members appear to be in the room with
you. Tomorrow’s datacenter or supercomputer may see components spread
throughout a building or even an entire campus, communicating with each
other at high speed, as opposed to being confined by heavy copper cables
with limited capacity and reach. This will allow datacenter users, such
as a search engine company, cloud computing provider or financial
datacenter, to increase performance, capabilities and save significant
costs in space and energy, or help scientists build more powerful
supercomputers to solve the world’s biggest problems.
Justin Rattner, Intel chief technology officer and director of Intel
Labs, demonstrated the Silicon Photonics Link at the Integrated
Photonics Research conference in Monterey, Calif. The 50Gbps link is
akin to a “concept vehicle” that allows Intel researchers to test new
ideas and continue the company’s quest to develop technologies that
transmit data over optical fibers, using light beams from low cost and
easy to make silicon, instead of costly and hard to make devices using
exotic materials like gallium arsenide. While telecommunications and
other applications already use lasers to transmit information, current
technologies are too expensive and bulky to be used for PC applications.
“This achievement of the world’s first 50Gbps silicon photonics link
with integrated hybrid silicon lasers marks a significant achievement in
our long term vision of ‘siliconizing’ photonics and bringing high
bandwidth, low cost optical communications in and around future PCs,
servers, and consumer devices,” Rattner said.
The 50Gbps Silicon Photonics Link prototype is the result of a
multi-year silicon photonics research agenda, which included numerous
“world firsts.” It is composed of a silicon transmitter and a receiver
chip, each integrating all the necessary building blocks from previous
Intel breakthroughs including the first Hybrid
Silicon Laser co-developed with the University of California at
Santa Barbara in 2006 as well as high-speed
optical modulators and photodetectors
announced in 2007.
The transmitter chip is composed of four such lasers, whose light beams
each travel into an optical modulator that encodes data onto them at
12.5Gbps. The four beams are then combined and output to a single
optical fiber for a total data rate of 50Gbps. At the other end of the
link, the receiver chip separates the four optical beams and directs
them into photo detectors, which convert data back into electrical
signals. Both chips are assembled using low-cost manufacturing
techniques familiar to the semiconductor industry. Intel researchers are
already working to increase the data rate by scaling the modulator speed
as well as increase the number of lasers per chip, providing a path to
future terabit/s optical links – rates fast enough to transfer a copy of
the entire contents of a typical laptop in one second.
This research is separate from Intel’s Light Peak technology, though
both are components of Intel’s overall I/O strategy. Light Peak is an
effort to bring a multi-protocol 10Gbps optical connection to Intel
client platforms for nearer-term applications. Silicon Photonics
research aims to use silicon integration to bring dramatic cost
reductions, reach tera-scale data rates, and bring optical
communications to an even broader set of high-volume applications.
Today’s achievement brings Intel a significant step closer to that goal.